Mechanical strengthening of silicon torsion bar of MEMS scanning mirror by hydrogen anneal

R. Hajika, S. Yoshida, W. Makishi, Y. Kanamori, S. Tanaka, M. Esashi

研究成果: Conference contribution

10 被引用数 (Scopus)

抄録

This paper reports on the strengthening effect of hydrogen anneal on torsional fracture strength of single crystal silicon (SCS). Moving-magnet-type MEMS mirrors were prepared by fabricating SCS and silicon on insulator (SOI) wafers via deep reactive ion etching (DRIE) as fracture test specimens. As a result of the fracture test of the torsion bar on the mirrors, the torsion bar fabricated using a SCS wafer could be strengthened to about 4 times in average by hydrogen anneal. By contrast, that using a SOI wafer was weaken to half. This mechanical strengthening effect has the potential ability to provide highly-reliable and tough SCS-based MEMS devices.

本文言語English
ホスト出版物のタイトルIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
ページ425-428
ページ数4
DOI
出版ステータスPublished - 2013
外部発表はい
イベントIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
継続期間: 2013 1月 202013 1月 24

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Conference

ConferenceIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
国/地域Taiwan, Province of China
CityTaipei
Period13/1/2013/1/24

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 機械工学
  • 電子工学および電気工学

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