Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

研究成果: Conference contribution

抜粋

In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn- Ag-Cu solder joint was investigated using the solder ball of 630 μm and 100 μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630 μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become highangle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100 μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100 μm specimen shortens without the stable crack growth compared to the 630 m specimen.

元の言語English
ホスト出版物のタイトルASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOI
出版物ステータスPublished - 2013 12 1
イベントASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
継続期間: 2013 7 162013 7 18

出版物シリーズ

名前ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
1

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
United States
Burlingame, CA
期間13/7/1613/7/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

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  • これを引用

    Kontani, H., Kariya, Y., & Fumikura, T. (2013). Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. : ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; 巻数 1). https://doi.org/10.1115/IPACK2013-73192