Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

研究成果: Conference contribution

抄録

In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn- Ag-Cu solder joint was investigated using the solder ball of 630 μm and 100 μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630 μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become highangle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100 μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100 μm specimen shortens without the stable crack growth compared to the 630 m specimen.

元の言語English
ホスト出版物のタイトルASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
1
DOI
出版物ステータスPublished - 2013
イベントASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA
継続期間: 2013 7 162013 7 18

Other

OtherASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Burlingame, CA
期間13/7/1613/7/18

Fingerprint

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation
Fatigue of materials
Recovery

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

これを引用

Kontani, H., Kariya, Y., & Fumikura, T. (2013). Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. : ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (巻 1) https://doi.org/10.1115/IPACK2013-73192

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. / Kontani, Hiroyuki; Kariya, Yoshiharu; Fumikura, Tomoya.

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1 2013.

研究成果: Conference contribution

Kontani, H, Kariya, Y & Fumikura, T 2013, Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. : ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻. 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, Burlingame, CA, 13/7/16. https://doi.org/10.1115/IPACK2013-73192
Kontani H, Kariya Y, Fumikura T. Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. : ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1. 2013 https://doi.org/10.1115/IPACK2013-73192
Kontani, Hiroyuki ; Kariya, Yoshiharu ; Fumikura, Tomoya. / Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 巻 1 2013.
@inproceedings{f6700296c2074ff2a172e475cc834124,
title = "Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint",
abstract = "In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn- Ag-Cu solder joint was investigated using the solder ball of 630 μm and 100 μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630 μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become highangle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100 μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100 μm specimen shortens without the stable crack growth compared to the 630 m specimen.",
author = "Hiroyuki Kontani and Yoshiharu Kariya and Tomoya Fumikura",
year = "2013",
doi = "10.1115/IPACK2013-73192",
language = "English",
isbn = "9780791855751",
volume = "1",
booktitle = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013",

}

TY - GEN

T1 - Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

AU - Kontani, Hiroyuki

AU - Kariya, Yoshiharu

AU - Fumikura, Tomoya

PY - 2013

Y1 - 2013

N2 - In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn- Ag-Cu solder joint was investigated using the solder ball of 630 μm and 100 μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630 μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become highangle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100 μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100 μm specimen shortens without the stable crack growth compared to the 630 m specimen.

AB - In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn- Ag-Cu solder joint was investigated using the solder ball of 630 μm and 100 μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630 μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become highangle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100 μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100 μm specimen shortens without the stable crack growth compared to the 630 m specimen.

UR - http://www.scopus.com/inward/record.url?scp=84894675640&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84894675640&partnerID=8YFLogxK

U2 - 10.1115/IPACK2013-73192

DO - 10.1115/IPACK2013-73192

M3 - Conference contribution

AN - SCOPUS:84894675640

SN - 9780791855751

VL - 1

BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013

ER -