| 元の言語 | English |
|---|---|
| ジャーナル | Proc. Of International Conference on Electronics Materials and Packaging |
| 巻 | EMAP2011 |
| 出版物ステータス | Published - 2011 12 1 |
これを引用
Sato, T., K, Y., a, A., & Kariya, Y. (2011). Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature. Proc. Of International Conference on Electronics Materials and Packaging, EMAP2011.
Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature. / Sato, T.; K, Y.; a, a; Kariya, Y.
：: Proc. Of International Conference on Electronics Materials and Packaging, 巻 EMAP2011, 01.12.2011.研究成果: Article
Sato, T, K, Y, a, A & Kariya, Y 2011, 'Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature', Proc. Of International Conference on Electronics Materials and Packaging, 巻. EMAP2011.
Sato T, K Y, a A, Kariya Y. Microstructure and Fatigue Damage of Eutectic Bi-Sn Alloy at High Temperature. Proc. Of International Conference on Electronics Materials and Packaging. 2011 12 1;EMAP2011.
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JO - Proc. Of International Conference on Electronics Materials and Packaging
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