Microstructure and texture of electroplated copper in damascene structures

M. E. Gross, C. Lingk, T. Siegrist, E. Coleman, W. L. Brown, K. Ueno, Y. Tsuchiya, N. Itoh, T. Ritzdorf, J. Turner, K. Gibbons, E. Klawuhn, M. Biberger, W. Y.C. Lai, J. F. Miner, al et al

研究成果: Conference article

22 引用 (Scopus)


The transition from Al to Cu for advanced ULSI interconnects involves changes in architecture and deposition technique that will influence the microstructure and texture of the metal. Cu interconnects are typically formed within the confines of pre-patterned trenches and vias using an electroplating process with a sputtered Cu conduction layer deposited over a refractory metal-based diffusion barrier layer. In this paper, we focus on the influence of the barrier layer (PVD Ti/TiN, Ta, TaN, CVD TiN) and the effect of a vacuum break between barrier and conduction layer depositions, on the texture of the Cu lines, as examined by X-ray diffraction pole figure analysis. A preferred (111) orientation was observed for all samples. The samples with no vacuum break between barrier and conduction layer deposition exhibited in plane anisotropy that was particularly pronounced for the Ta and TaN samples compared with the Ti/TiN sample. Focused ion beam images and transmission electron micrographs showed Cu grain size to be on the order of the trench width with a high degree of twinning, and no boundary could be distinguished between the PVD Cu conduction layer and the electroplated Cu.

ジャーナルMaterials Research Society Symposium - Proceedings
出版物ステータスPublished - 1998 1 1
イベントProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
継続期間: 1998 4 131998 4 15

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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    Gross, M. E., Lingk, C., Siegrist, T., Coleman, E., Brown, W. L., Ueno, K., Tsuchiya, Y., Itoh, N., Ritzdorf, T., Turner, J., Gibbons, K., Klawuhn, E., Biberger, M., Lai, W. Y. C., Miner, J. F., & et al, A. (1998). Microstructure and texture of electroplated copper in damascene structures. Materials Research Society Symposium - Proceedings, 514, 293-298. https://doi.org/10.1557/proc-514-293