Millimeter-wave three-dimensional masterslice MMICs

Kenjiro Nishikawa, Kenji Kamogawa, Koh Inoue, Kiyomitsu Onodera, Makoto Hirano, Tsuneo Tokumitsu, Ichihiko Toyoda

研究成果: Conference contribution

抜粋

The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.

元の言語English
ホスト出版物のタイトルIEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers
出版場所Piscataway, NJ, United States
出版者IEEE
ページ239-242
ページ数4
出版物ステータスPublished - 1998
外部発表Yes
イベントProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Baltimore, MD, USA
継続期間: 1998 6 71998 6 11

Other

OtherProceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
Baltimore, MD, USA
期間98/6/798/6/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Media Technology

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  • これを引用

    Nishikawa, K., Kamogawa, K., Inoue, K., Onodera, K., Hirano, M., Tokumitsu, T., & Toyoda, I. (1998). Millimeter-wave three-dimensional masterslice MMICs. : IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers (pp. 239-242). IEEE.