Multichip module technology using AlN substrate for 2-Gbit/s high-speed switching module

Yuji Iseki, Fumihiko Shimizu, Toshio Sudo

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

The authors describe a multichip module (MCM) technology for making broadband digital switching modules. A copper/polyimide thin-film multilayer substrate is developed to achieve high-speed digital transmission. The substrate is formed on an aluminum nitride ceramic (AlN) wafer with good thermal characteristics. The meshed strip-line structure is used to control the characteristic impedance for 50-Ω signal lines, and the thin-film termination resistors are made of NiCr to prevent reflections. With this technology, the authors experimentally fabricated a broadband digital switching module, which is constructed from switching ICs in bare dies, clock distributing ICs in flat lead packages, and chip/micro-chip capacitors. In this module, differential digital transmission lines are adopted for high-speed signals to reduce the crosstalk noise effect. Heat generated from the module, which has a total of 25 W of power dissipation, is efficiently conducted through the AlN wafer. This module can operate many 2-Gb/s high-speed channels. A novel multichip module technology for high-performance systems was successfully developed.

本文言語English
ホスト出版物のタイトルProceedings - Electronic Components Conference
出版社Publ by IEEE
ページ973-978
ページ数6
ISBN(印刷版)0818626607
出版ステータスPublished - 1992 1
イベントProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
継続期間: 1992 5 181992 5 20

出版物シリーズ

名前Proceedings - Electronic Components Conference
ISSN(印刷版)0569-5503

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA
Period92/5/1892/5/20

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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