New bonding mechanism of 50 μm pitch TAB-ILB with 0.25 μm Sn plated Cu lead
Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa, Koji Shibasaki, Yoichi Hiruta, Toshio Sudo
研究成果: Conference article › 査読
1
被引用数
(Scopus)