New electrical modeling approach for simultaneous switching noise for high-performance packages

Katsuto Kato, Masayuki Miura, Kenji Ito, Yasuhiro Yamaji, Toshio Sudo

研究成果: Conference article査読

3 被引用数 (Scopus)

抄録

Efficient package modeling is required to predict a package electrical performance such as simultaneous switching noise (SSN) at an early design stage for high-performance packages. This paper describes a new modelling approach for SSN applicable to various package structures. The efficient and synthetic modeling approach which we call 'segment model' was constructed on the basis of the ratio of signal-to-power/ground counts for both the inner leads and outer leads. To verify the validity of the segment model, SSN induced in ceramic land grid array (C-LGA) with a socket was measured by an LSI tester and the result was compared with simulation data.

本文言語English
ページ(範囲)739-746
ページ数8
ジャーナルProceedings - Electronic Components and Technology Conference
出版ステータスPublished - 1996 1 1
イベントProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
継続期間: 1996 5 281996 5 31

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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