Efficient package modeling is required to predict a package electrical performance such as simultaneous switching noise (SSN) at an early design stage for high-performance packages. This paper describes a new modelling approach for SSN applicable to various package structures. The efficient and synthetic modeling approach which we call 'segment model' was constructed on the basis of the ratio of signal-to-power/ground counts for both the inner leads and outer leads. To verify the validity of the segment model, SSN induced in ceramic land grid array (C-LGA) with a socket was measured by an LSI tester and the result was compared with simulation data.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版ステータス||Published - 1996 1月 1|
|イベント||Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA|
継続期間: 1996 5月 28 → 1996 5月 31
ASJC Scopus subject areas