New polyimide film paves way for super high-speed logic devices

Tetsuya Homma, Youichiro Numasawa, Yukinobu Murao, Kuniyuki Hamano

研究成果: Article査読

1 被引用数 (Scopus)

抄録

Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.

本文言語English
ページ(範囲)74-79
ページ数6
ジャーナルJEE. Journal of electronic engineering
25
263
出版ステータスPublished - 1988 11 1
外部発表はい

ASJC Scopus subject areas

  • 工学(全般)

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