Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue

研究成果 › 査読

本文言語	English
ページ（範囲）	150-155
ページ数	6
ジャーナル	Journal of Japan Institute of Electronics Packaging
巻	8
号	2
DOI	https://doi.org/10.5104/jiep.8.150
出版ステータス	Published - 2005
外部発表	はい

ASJC Scopus subject areas

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title = "Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue",

author = "Yoshiharu Kariya and Minoru Mukai",

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