Novel interconnection technology for three-dimensional MMICs

Makoto Hirano, Suehiro Sugitani, Shinji Aoyama, Kiyomitsu Onodera

    研究成果: Article査読

    抄録

    A novel fabrication technology has been developed to implement three-dimensional MMICs. This technology enables us to form a three-dimensional structure of interconnections in a 10-μm-thick polyimide insulator matrix ; for example, four horizontal metal layers, pillar-like vertical vias, and wall-like vertical microwires for shielding as a ground plane. Many passive elements and circuits can be formed in a small area in multiple levels with vertical structures, not only on GaAs IC chips but also on Si IC chips. Si masterslice MMIC, which are a typical example of three-dimensional MMICs, can be fabricated using this technology.

    本文言語English
    ページ(範囲)1277-1283
    ページ数7
    ジャーナルNTT R and D
    45
    12
    出版ステータスPublished - 1996 12 1

    ASJC Scopus subject areas

    • 電子工学および電気工学

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