Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

研究成果: Paper査読

抄録

This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

本文言語English
ページ310-317
ページ数8
出版ステータスPublished - 1995 12 1
イベントProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA
継続期間: 1995 10 21995 10 4

Other

OtherProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
CityAustin, TX, USA
Period95/10/295/10/4

ASJC Scopus subject areas

  • 産業および生産工学
  • 電子工学および電気工学

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