This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.
|出版ステータス||Published - 1995 12月 1|
|イベント||Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA|
継続期間: 1995 10月 2 → 1995 10月 4
|Other||Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium|
|City||Austin, TX, USA|
|Period||95/10/2 → 95/10/4|
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