Numerical simulation of gold nanoparticles dynamics in dielectrophoretic assembly

Ryosuke Nakagawara, Satoshi Uchida, Taiichi Shibuya, Hiroyuki Nishikawa

研究成果: Article査読

抄録

The functional granular devices assembled by dielectrophoresis are expected to be using as high performance sensors. For the optimum fabrication of these devices, it is necessary to understand the behavior of nanoparticles in dielectrophoretic assembly. In this study, we evaluated the validity of the present analytical model, and investigated the influence of various setting parameters on particle coagulation. Many particles adhered to the edge of pit due to the formation of strong electric field. The transport and aggregation properties of Au nanoparticles were obtained theoretically and quantitatively. These analytical results qualitatively agreed with our experimental ones.

本文言語English
ページ(範囲)107-114
ページ数8
ジャーナルIEEJ Transactions on Sensors and Micromachines
137
4
DOI
出版ステータスPublished - 2017

ASJC Scopus subject areas

  • 機械工学
  • 電子工学および電気工学

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