On-chip power integrity evaluation system

Yoshitaka Nabeshima, Yoshiaki Oizono, Takafumi Okumura, Toshio Sudo

研究成果: Conference contribution

抜粋

Power supply disturbance excited by simultaneous switching output (SSO) circuits or core circuits is a serious issue in a system-in-package (SIP), especially in 3D stacked die package, because much more I/O circuits and core circuits excited simultaneously in synchronized with clock edges than the case of single die package. Therefore, decoupling schemes in such SiP's must be carefully designed including on-chip capacitance as well as off-chip capacitance so as to reduce the impedance of power distribution network (PDN) as low as possible up to high frequency range. In this paper, an on-chip power integrity evaluation system has been established using a test chip with both noise generating circuits and monitoring circuits for on-chip power supply noise. On-chip power integrity has been examined and compared for the cases with and without on-chip capacitance and for the various embedded capacitors inside an interposer.

元の言語English
ホスト出版物のタイトルProceedings of the 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits 2011, EMC COMPO 2011
ページ165-169
ページ数5
出版物ステータスPublished - 2011 12 1
イベント8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2011 - Dubrovnik, Croatia
継続期間: 2011 11 62011 11 9

出版物シリーズ

名前Proceedings of the 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits 2011, EMC COMPO 2011

Conference

Conference8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2011
Croatia
Dubrovnik
期間11/11/611/11/9

    フィンガープリント

ASJC Scopus subject areas

  • Hardware and Architecture

これを引用

Nabeshima, Y., Oizono, Y., Okumura, T., & Sudo, T. (2011). On-chip power integrity evaluation system. : Proceedings of the 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits 2011, EMC COMPO 2011 (pp. 165-169). [6130087] (Proceedings of the 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits 2011, EMC COMPO 2011).