Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

J. Kato; N. Sakai; S. Miyata; M. Konishi; Y. Yamada; N. Chikumoto; K. Nakao; T. Izumi; Y. Shiohara

doi:10.1016/j.physc.2007.02.058

Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

J. Kato, N. Sakai, S. Miyata, M. Konishi, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, Y. Shiohara

研究成果: Article › 査読

28 被引用数 (Scopus)

抄録

Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10^-13 Ω m² at the joint without any degradation of I_c was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in I_c after joint held at 873 K.

本文言語	English
ページ（範囲）	747-750
ページ数	4
ジャーナル	Physica C: Superconductivity and its applications
巻	463-465
号	SUPPL.
DOI	https://doi.org/10.1016/j.physc.2007.02.058
出版ステータス	Published - 2007 10月 1
外部発表	はい

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
凝縮系物理学
エネルギー工学および電力技術
電子工学および電気工学

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10.1016/j.physc.2007.02.058

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title = "Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors",

abstract = "Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.",

keywords = "Ag, Coated conductor, Diffusion joint, YBCO",

author = "J. Kato and N. Sakai and S. Miyata and M. Konishi and Y. Yamada and N. Chikumoto and K. Nakao and T. Izumi and Y. Shiohara",

note = "Funding Information: This work was supported by the New Energy and Industrial Technology Development Organization (NEDO) as the Collaborative Research and Development of Fundamental Technologies for Superconductivity Applications. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.",

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doi = "10.1016/j.physc.2007.02.058",

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AU - Kato, J.

AU - Sakai, N.

AU - Miyata, S.

AU - Konishi, M.

AU - Yamada, Y.

AU - Chikumoto, N.

AU - Nakao, K.

AU - Izumi, T.

AU - Shiohara, Y.

N1 - Funding Information: This work was supported by the New Energy and Industrial Technology Development Organization (NEDO) as the Collaborative Research and Development of Fundamental Technologies for Superconductivity Applications. Copyright: Copyright 2008 Elsevier B.V., All rights reserved.

PY - 2007/10/1

Y1 - 2007/10/1

N2 - Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.

AB - Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.

KW - Ag

KW - Coated conductor

KW - Diffusion joint

KW - YBCO

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SN - 0921-4534

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Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

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