Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors

J. Kato, N. Sakai, S. Miyata, M. Konishi, Y. Yamada, N. Chikumoto, K. Nakao, T. Izumi, Y. Shiohara

研究成果: Article査読

28 被引用数 (Scopus)

抄録

Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.

本文言語English
ページ(範囲)747-750
ページ数4
ジャーナルPhysica C: Superconductivity and its applications
463-465
SUPPL.
DOI
出版ステータスPublished - 2007 10月 1
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • エネルギー工学および電力技術
  • 電子工学および電気工学

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