抜粋
Diffusion joint processes using Ag stabilizing layer for YBCO tape were performed in varied parameter such as temperature, time duration, cooling procedure and conditions of surface for Ag stabilizing layer to optimize for joint condition. We succeeded in developing a brief process with which low resistance below 5 × 10-13 Ω m2 at the joint without any degradation of Ic was achieved by polishing surface of Ag stabilizing layer and quenching procedure. The polishing is effective in reducing joint time and temperature. The mechanism was discussed for the decrease in Ic after joint held at 873 K.
| 元の言語 | English |
|---|---|
| ページ（範囲） | 747-750 |
| ページ数 | 4 |
| ジャーナル | Physica C: Superconductivity and its applications |
| 巻 | 463-465 |
| 発行部数 | SUPPL. |
| DOI | |
| 出版物ステータス | Published - 2007 10 1 |
| 外部発表 | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering
フィンガープリント Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。
これを引用
Kato, J., Sakai, N., Miyata, S., Konishi, M., Yamada, Y., Chikumoto, N., Nakao, K., Izumi, T., & Shiohara, Y. (2007). Optimization of the diffusion joint process for the Ag layers of YBCO coated conductors. Physica C: Superconductivity and its applications, 463-465(SUPPL.), 747-750. https://doi.org/10.1016/j.physc.2007.02.058