Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Ploybussara Gomasang, Satoru Ogiue, Kazuyoshi Ueno, Shinji Yokogawa

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.

元の言語English
ホスト出版物のタイトル2018 IEEE International Interconnect Technology Conference, IITC 2018
出版者Institute of Electrical and Electronics Engineers Inc.
ページ112-114
ページ数3
ISBN(印刷物)9781538643372
DOI
出版物ステータスPublished - 2018 8 8
イベント2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States
継続期間: 2018 6 42018 6 7

Other

Other2018 IEEE International Interconnect Technology Conference, IITC 2018
United States
Santa Clara
期間18/6/418/6/7

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

これを引用

Gomasang, P., Ogiue, S., Ueno, K., & Yokogawa, S. (2018). Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity. : 2018 IEEE International Interconnect Technology Conference, IITC 2018 (pp. 112-114). [8430461] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.2018.8430461