Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Ploybussara Gomasang, Satoru Ogiue, Kazuyoshi Ueno, Shinji Yokogawa

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.

本文言語English
ホスト出版物のタイトル2018 IEEE International Interconnect Technology Conference, IITC 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ページ112-114
ページ数3
ISBN(印刷版)9781538643372
DOI
出版ステータスPublished - 2018 8 8
イベント2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States
継続期間: 2018 6 42018 6 7

出版物シリーズ

名前2018 IEEE International Interconnect Technology Conference, IITC 2018

Other

Other2018 IEEE International Interconnect Technology Conference, IITC 2018
国/地域United States
CitySanta Clara
Period18/6/418/6/7

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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