@inproceedings{6961d7f209704a46848392baef16a1c4,
title = "Package deformation and cracking mechanism due to reflow soldering",
abstract = "Plastic package cracking during reflow soldering is an important problem for the reliability of plastic encapsulated semiconductor devices. This paper describes a simplified method of package cracking estimation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture constant. The consequent process of package expansion during reflow soldering was measured. The individual processes were fitted by calculation and provided a precise mechanism of package cracking.",
author = "Kanako Sawada and Tsutomu Nakazawa and Noriyasu Kawamura and Toshio Sudo",
year = "1993",
month = dec,
day = "1",
language = "English",
isbn = "0780314328",
series = "IEEE/CHMT European International Electronic Manufacturing Technology Symposium",
publisher = "Publ by IEEE",
pages = "295--298",
booktitle = "IEEE/CHMT European International Electronic Manufacturing Technology Symposium",
note = "Proceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium ; Conference date: 09-06-1993 Through 11-06-1993",
}