Package deformation and cracking mechanism due to reflow soldering

Kanako Sawada, Tsutomu Nakazawa, Noriyasu Kawamura, Toshio Sudo

研究成果: Conference contribution

17 被引用数 (Scopus)

抄録

Plastic package cracking during reflow soldering is an important problem for the reliability of plastic encapsulated semiconductor devices. This paper describes a simplified method of package cracking estimation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture constant. The consequent process of package expansion during reflow soldering was measured. The individual processes were fitted by calculation and provided a precise mechanism of package cracking.

本文言語English
ホスト出版物のタイトルIEEE/CHMT European International Electronic Manufacturing Technology Symposium
出版社Publ by IEEE
ページ295-298
ページ数4
ISBN(印刷版)0780314328
出版ステータスPublished - 1993 12 1
イベントProceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium - Kanazawa, Jpn
継続期間: 1993 6 91993 6 11

出版物シリーズ

名前IEEE/CHMT European International Electronic Manufacturing Technology Symposium

Other

OtherProceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium
CityKanazawa, Jpn
Period93/6/993/6/11

ASJC Scopus subject areas

  • Engineering(all)

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