Partly-additive process for manufacturing high-density printed wiring boards

Shinichiro Imabayashi, Isamu Tanaka, Hiroshi Kikuchi, Makio Watanabe, Hitoshi Oka, Shusaku Izumi, Yukihiro Taniguchi, Shigeru Fujita

研究成果: Conference contribution

2 引用 (Scopus)

抜粋

A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

元の言語English
ホスト出版物のタイトルProceedings - Electronic Components Conference
出版者Publ by IEEE
ページ1053-1059
ページ数7
ISBN(印刷物)0818626607
出版物ステータスPublished - 1992 1 1
イベントProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
継続期間: 1992 5 181992 5 20

出版物シリーズ

名前Proceedings - Electronic Components Conference
ISSN(印刷物)0569-5503

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
San Diego, CA, USA
期間92/5/1892/5/20

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • これを引用

    Imabayashi, S., Tanaka, I., Kikuchi, H., Watanabe, M., Oka, H., Izumi, S., Taniguchi, Y., & Fujita, S. (1992). Partly-additive process for manufacturing high-density printed wiring boards. : Proceedings - Electronic Components Conference (pp. 1053-1059). (Proceedings - Electronic Components Conference). Publ by IEEE.