Partly-additive process for manufacturing high-density printed wiring boards

Shinichiro Imabayashi, Isamu Tanaka, Hiroshi Kikuchi, Makio Watanabe, Hitoshi Oka, Shusaku Izumi, Yukihiro Taniguchi, Shigeru Fujita

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

本文言語English
ホスト出版物のタイトルProceedings - Electronic Components Conference
出版社Publ by IEEE
ページ1053-1059
ページ数7
ISBN(印刷版)0818626607
出版ステータスPublished - 1992 1 1
外部発表はい
イベントProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
継続期間: 1992 5 181992 5 20

出版物シリーズ

名前Proceedings - Electronic Components Conference
ISSN(印刷版)0569-5503

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA
Period92/5/1892/5/20

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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