PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure

T.Sudo T.Sudo, Y.Oizono Y.Oizono, Y.Nabeshima Y.Nabeshima, T.Okumura T.Okumura, A.Sakai A.Sakai, S.Uchiyam S.Uchiyam, H.Ikeda H.Ikeda, Toshio Sudo

研究成果: Article

元の言語English
ジャーナルProceedings of IEEE 3DIC 2011
出版物ステータスPublished - 2012 2 2

これを引用

T.Sudo, T. S., Y.Oizono, Y. O., Y.Nabeshima, Y. N., T.Okumura, T. O., A.Sakai, A. S., S.Uchiyam, S. U., ... Sudo, T. (2012). PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. Proceedings of IEEE 3DIC 2011.

PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. / T.Sudo, T.Sudo; Y.Oizono, Y.Oizono; Y.Nabeshima, Y.Nabeshima; T.Okumura, T.Okumura; A.Sakai, A.Sakai; S.Uchiyam, S.Uchiyam; H.Ikeda, H.Ikeda; Sudo, Toshio.

:: Proceedings of IEEE 3DIC 2011, 02.02.2012.

研究成果: Article

T.Sudo, TS, Y.Oizono, YO, Y.Nabeshima, YN, T.Okumura, TO, A.Sakai, AS, S.Uchiyam, SU, H.Ikeda, HI & Sudo, T 2012, 'PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure', Proceedings of IEEE 3DIC 2011.
T.Sudo TS, Y.Oizono YO, Y.Nabeshima YN, T.Okumura TO, A.Sakai AS, S.Uchiyam SU その他. PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. Proceedings of IEEE 3DIC 2011. 2012 2 2.
T.Sudo, T.Sudo ; Y.Oizono, Y.Oizono ; Y.Nabeshima, Y.Nabeshima ; T.Okumura, T.Okumura ; A.Sakai, A.Sakai ; S.Uchiyam, S.Uchiyam ; H.Ikeda, H.Ikeda ; Sudo, Toshio. / PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. :: Proceedings of IEEE 3DIC 2011. 2012.
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