Plasma-cavitation pencil cutter for powerful micro-processing

Y. Arakawa, M. Ohmura, D. Tsujimoto, Y. Yamanishi

研究成果: Conference contribution

抄録

We have successfully developed novel processing equipment based on the combined of cavitation and plasma irradiation. This technique uses the strong points of the powerful ablation of cavitation as well as plasma irradiation. The novelty of the technique enable to process not only conductive material but also non-conductive material such as polymer, CFRP (carbon fiber reinforced plastic) and silicon, which is unlike conventional wire electric discharge machine. Also, the directional transportation of bubbles provides positioning accuracy of micro-processing. The structure of the plasma-cavitation pencil cutter is low cost and very simple structure. This technology contributes to effective processing of wide range of materials such as metal plate, polymer, carbon-fiber and biomaterials.

本文言語English
ホスト出版物のタイトル2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ521-524
ページ数4
ISBN(印刷版)9781479989553
DOI
出版ステータスPublished - 2015 8 5
イベント18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
継続期間: 2015 6 212015 6 25

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
国/地域United States
CityAnchorage
Period15/6/2115/6/25

ASJC Scopus subject areas

  • 器械工学
  • 電子工学および電気工学

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