Preparation and wear resistance of TiBC, TiBN, SiNx single layer film and TiBC-SiNx and TiBN-SiNx double layer film by thermal plasma CVD

Yusuke Fuji, Shiro Shimada, Hajime Kiyono

研究成果: Article

3 引用 (Scopus)

抜粋

Monolithic (TiBC, TiBN, SiNx) and double layered films (TiBC-SiNx, TiBN-SiNx) were deposited on Si wafers or WC-Co substrates at about 800°C from a hexamethyldisiloxane, titanium tetra-ethoxide or tri-ethoxy borate solution and their mixed solution by thermal plasma chemical vapor deposition. The films were characterized by thin film X-raydiffractmetry (XRD), X-ray photoelectron spectroscopy, scanning electron microscopy, EDS analysis and the cutting tests. XRD indicated that TiBC and TiBN phases were crystalline, but SiNx was amorphous. Thickness of under-layered TiBC or TiBN and over-layered SiNx in the double layered films was 0.5 and 2-4μm, respectively. The cutting tests for the double layered film deposited on WC-Co showed that the double layered TiBC-SiNx and TiBN-SiNx films possessed the good wear resistance comparable to or higher than the commercial TiN film deposited on WC-Co prepared by thermal CVD, in terms of crater and flank wear resistances.

元の言語English
ページ(範囲)287-293
ページ数7
ジャーナルFuntai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
54
発行部数4
DOI
出版物ステータスPublished - 2007 4 1

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Metals and Alloys
  • Materials Chemistry

フィンガープリント Preparation and wear resistance of TiBC, TiBN, SiN<sub>x</sub> single layer film and TiBC-SiN<sub>x</sub> and TiBN-SiN<sub>x</sub> double layer film by thermal plasma CVD' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用