抄録
Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.
| 元の言語 | English |
|---|---|
| ページ（範囲） | 684-690 |
| ページ数 | 7 |
| ジャーナル | IEICE Transactions on Electronics |
| 巻 | E78-C |
| 発行部数 | 6 |
| 出版物ステータス | Published - 1995 6 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
これを引用
Present and future directions for multichip module technologies. / Sudo, Toshio.
：: IEICE Transactions on Electronics, 巻 E78-C, 番号 6, 06.1995, p. 684-690.研究成果: Article
}
TY - JOUR
T1 - Present and future directions for multichip module technologies
AU - Sudo, Toshio
PY - 1995/6
Y1 - 1995/6
N2 - Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.
AB - Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.
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UR - http://www.scopus.com/inward/citedby.url?scp=0029325618&partnerID=8YFLogxK
M3 - Article
VL - E78-C
SP - 684
EP - 690
JO - IEICE Transactions on Electronics
JF - IEICE Transactions on Electronics
SN - 0916-8524
IS - 6
ER -