Present and future directions for multichip module technologies

Toshio Sudo

研究成果: Conference contribution

2 引用 (Scopus)

抄録

The paper discusses the present and future directions for multichip module technologies. Multichip modules provide benefits to obtain smaller, lighter systems and higher speed performance by eliminating individual packages and their parasitics. MCMs have been developed for high performance systems such as mainframe computers. Also discussed in detail are the electrical design issues of MCMs.

元の言語English
ホスト出版物のタイトルIEEE Symposium on VLSI Circuits, Digest of Technical Papers
出版場所Piscataway, NJ, United States
出版者IEEE
ページ51-54
ページ数4
出版物ステータスPublished - 1994
イベントProceedings of the 1994 Symposium on VLSI Circuits - Honolulu, HI, USA
継続期間: 1994 6 91994 6 11

Other

OtherProceedings of the 1994 Symposium on VLSI Circuits
Honolulu, HI, USA
期間94/6/994/6/11

Fingerprint

Multichip modules
Multicarrier modulation

ASJC Scopus subject areas

  • Engineering(all)

これを引用

Sudo, T. (1994). Present and future directions for multichip module technologies. : IEEE Symposium on VLSI Circuits, Digest of Technical Papers (pp. 51-54). Piscataway, NJ, United States: IEEE.

Present and future directions for multichip module technologies. / Sudo, Toshio.

IEEE Symposium on VLSI Circuits, Digest of Technical Papers. Piscataway, NJ, United States : IEEE, 1994. p. 51-54.

研究成果: Conference contribution

Sudo, T 1994, Present and future directions for multichip module technologies. : IEEE Symposium on VLSI Circuits, Digest of Technical Papers. IEEE, Piscataway, NJ, United States, pp. 51-54, Proceedings of the 1994 Symposium on VLSI Circuits, Honolulu, HI, USA, 94/6/9.
Sudo T. Present and future directions for multichip module technologies. : IEEE Symposium on VLSI Circuits, Digest of Technical Papers. Piscataway, NJ, United States: IEEE. 1994. p. 51-54
Sudo, Toshio. / Present and future directions for multichip module technologies. IEEE Symposium on VLSI Circuits, Digest of Technical Papers. Piscataway, NJ, United States : IEEE, 1994. pp. 51-54
@inproceedings{10e7a2ca9bad4b8aaba3e5785aff1688,
title = "Present and future directions for multichip module technologies",
abstract = "The paper discusses the present and future directions for multichip module technologies. Multichip modules provide benefits to obtain smaller, lighter systems and higher speed performance by eliminating individual packages and their parasitics. MCMs have been developed for high performance systems such as mainframe computers. Also discussed in detail are the electrical design issues of MCMs.",
author = "Toshio Sudo",
year = "1994",
language = "English",
pages = "51--54",
booktitle = "IEEE Symposium on VLSI Circuits, Digest of Technical Papers",
publisher = "IEEE",

}

TY - GEN

T1 - Present and future directions for multichip module technologies

AU - Sudo, Toshio

PY - 1994

Y1 - 1994

N2 - The paper discusses the present and future directions for multichip module technologies. Multichip modules provide benefits to obtain smaller, lighter systems and higher speed performance by eliminating individual packages and their parasitics. MCMs have been developed for high performance systems such as mainframe computers. Also discussed in detail are the electrical design issues of MCMs.

AB - The paper discusses the present and future directions for multichip module technologies. Multichip modules provide benefits to obtain smaller, lighter systems and higher speed performance by eliminating individual packages and their parasitics. MCMs have been developed for high performance systems such as mainframe computers. Also discussed in detail are the electrical design issues of MCMs.

UR - http://www.scopus.com/inward/record.url?scp=0028576055&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028576055&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0028576055

SP - 51

EP - 54

BT - IEEE Symposium on VLSI Circuits, Digest of Technical Papers

PB - IEEE

CY - Piscataway, NJ, United States

ER -