Present and future directions for multichip module technologies

Toshio Sudo

研究成果: Article査読

12 被引用数 (Scopus)

抄録

Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.

本文言語English
ページ(範囲)436-442
ページ数7
ジャーナルIEEE Journal of Solid-State Circuits
30
4
DOI
出版ステータスPublished - 1995 4 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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