TY - JOUR
T1 - Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects
AU - Li, Er Ping
AU - Wei, Xing Chang
AU - Cangellaris, Andreas C.
AU - Liu, En Xiao
AU - Zhang, Yao Jiang
AU - D'amore, Marcello
AU - Kim, Joungho
AU - Sudo, Toshio
PY - 2010/5
Y1 - 2010/5
N2 - The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.
AB - The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.
KW - Electromagnetic compatibility (EMC)
KW - Electronic package
KW - Nanointerconnect (nano-INC)
KW - Power integrity (PI)
KW - Printed circuit board (PCB)
KW - Signal integrity (SI)
KW - Through-silicon vias (TSVs)
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U2 - 10.1109/TEMC.2010.2048755
DO - 10.1109/TEMC.2010.2048755
M3 - Review article
AN - SCOPUS:77952744147
VL - 52
SP - 248
EP - 265
JO - IEEE Transactions on Electromagnetic Compatibility
JF - IEEE Transactions on Electromagnetic Compatibility
SN - 0018-9375
IS - 2
M1 - 5464324
ER -