Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects

Er Ping Li, Xing Chang Wei, Andreas C. Cangellaris, En Xiao Liu, Yao Jiang Zhang, Marcello D'amore, Joungho Kim, Toshio Sudo

研究成果: Review article査読

139 被引用数 (Scopus)

抄録

The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.

本文言語English
論文番号5464324
ページ(範囲)248-265
ページ数18
ジャーナルIEEE Transactions on Electromagnetic Compatibility
52
2
DOI
出版ステータスPublished - 2010 5 1

ASJC Scopus subject areas

  • 原子分子物理学および光学
  • 凝縮系物理学
  • 電子工学および電気工学

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