本文言語 | English |
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ジャーナル | IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging |
出版ステータス | Published - 2003 10月 25 |
Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,
K.Nakano K.Nakano, T.Sudo T.Sudo, S.Haga S.Haga, Toshio Sudo
研究成果: Article › 査読