| 元の言語 | English |
|---|---|
| ジャーナル | Microelectronics and Reliability |
| 出版物ステータス | Published - 1997 4 1 |
これを引用
Sugawara, H., & Hirano, M. (1997). Reliablity Study on Three-Dimensional Au/WSiN Interconnections for Ultra-Compact MMICs. Microelectronics and Reliability.
Reliablity Study on Three-Dimensional Au/WSiN Interconnections for Ultra-Compact MMICs
Hirohiko Sugawara, Makoto Hirano
研究成果: Article