Silicon surface processing techniques for micro-systems fabrication

Vygantas Mizeikis, Saulius Juodkazis, Jia Yu Ye, Andrei Rode, Shigeki Matsuo, Hiroaki Misawa

研究成果: Conference article

15 引用 (Scopus)

抜粋

Micromachining of silicon surface and near-surface regions by electron-beam lithography (EBL) and reactive ion dry-etching (RIE), as well as by laser microfabrication techniques is described. Combination of EBL and RIE techniques is used to fabricate quasi two-dimensional (2D) photonic crystal (PhC) structures with aspect ratios at approximately 15. Structural and optical properties of PhC samples with 2D honeycomb lattice are reported, and a complete photonic band gap at wavelengths approximately 2.16 μm is identified from the optical transmission data. Next, laser microfabrication of silicon by femtosecond laser pulses is reported. Processing of silicon under low air pressure conditions (≃5 Torr) is demonstrated to be essentially debris-free process, highly suitable for cutting and scribing of wafers as well for hole drilling. Removal of thin films from the silicon surface by a single-shot laser ablation using mask projection is also demonstrated.

元の言語English
ページ(範囲)445-451
ページ数7
ジャーナルThin Solid Films
438-439
DOI
出版物ステータスPublished - 2003 8 22
イベントThe 5th International Conference on Nano-Molecular Electronics - Kobe, Japan
継続期間: 2002 12 102002 12 12

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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