Simplified and practical estimation of package cracking during reflow soldering process

K. Sawada, T. Nakazawa, N. Kawamura, K. Matsumoto, Y. Hiruta, T. Sudo

研究成果: Conference contribution

17 被引用数 (Scopus)

抄録

A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.

本文言語English
ホスト出版物のタイトルAnnual Proceedings - Reliability Physics (Symposium)
出版社Publ by IEEE
ページ114-119
ページ数6
ISBN(印刷版)0780313577, 9780780313576
DOI
出版ステータスPublished - 1994
イベントProceedings of the 32nd Annual International Reliability Physics Proceedings - San Jose, CA, USA
継続期間: 1994 4月 121994 4月 14

出版物シリーズ

名前Annual Proceedings - Reliability Physics (Symposium)
ISSN(印刷版)0099-9512

Other

OtherProceedings of the 32nd Annual International Reliability Physics Proceedings
CitySan Jose, CA, USA
Period94/4/1294/4/14

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 安全性、リスク、信頼性、品質管理

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