Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

Yuhei Imai, Hiroyuki Manabe

研究成果: Conference contribution

抄録

The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.

本文言語English
ホスト出版物のタイトルAdjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
出版社Association for Computing Machinery, Inc
ページ126-128
ページ数3
ISBN(電子版)9781450386555
DOI
出版ステータスPublished - 2021 10月 10
イベント34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021 - Virtual, Online, United States
継続期間: 2021 10月 102021 10月 14

出版物シリーズ

名前Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021

Conference

Conference34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
国/地域United States
CityVirtual, Online
Period21/10/1021/10/14

ASJC Scopus subject areas

  • ソフトウェア
  • 人間とコンピュータの相互作用

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引用スタイル