Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

研究成果: Conference contribution

抜粋

A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.

元の言語English
ホスト出版物のタイトルProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ数1
ISBN(電子版)9784904743034
DOI
出版物ステータスPublished - 2017 6 13
イベント5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
継続期間: 2017 5 162017 5 18

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Japan
Tokyo
期間17/5/1617/5/18

    フィンガープリント

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

これを引用

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A., & Shimizu, H. (2017). Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via. : Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 [7947481] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947481