Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Kazuki Watanabe, Naoyuki Yajima, Yoshiharu Kariya, Yoshiyuki Hiroshima, Shunichi Kikuchi, Akiko Matsui, Hiroshi Shimizu

研究成果: Conference contribution

抄録

A new fatigue test method was proposed for low-cycle fatigue lives of electroplated copper for the through hole via (THV) in a printed wiring board. And the fatigue life of THV predicted from the Manson-Coffin's law of thermal fatigue test was good agreement with the thermal fatigue life obtained from the experimental result of thermal fatigue test of THV.

本文言語English
ホスト出版物のタイトルProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ85
ページ数1
ISBN(電子版)9784904743034
DOI
出版ステータスPublished - 2017 6 13
イベント5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
継続期間: 2017 5 162017 5 18

出版物シリーズ

名前Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
国/地域Japan
CityTokyo
Period17/5/1617/5/18

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 産業および生産工学
  • 電子材料、光学材料、および磁性材料
  • 表面、皮膜および薄膜

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