Ni-implantation has been conducted for sputter-deposited Zr and Zr-Cu films to investigate surface amorphization behavior in proportion to Ni by transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The film of Zr and Zr-Cu with the thickness of 200 nm has been prepared on (001) Si substrate with the certain area fraction of target materials. As deposited films show columnar hcp-Zr and nano-crystalline hcp-Zr(Cu). Ni-implantation induced surface amorphization of Zr and Zr-Cu with thickness of ∼100nm in depth. The critical concentration for amorphization via Ni implantation is calculated to be 20at%Ni for Zr, 6at%Ni for Zr-Cu film. The lower Ni concentration for amorphization of Zr-Cu might be attributed to the chemical interaction of Ni with Zr and Cu according to the negative heat of mixing.