SiO2 thin films were prepared by the sol‐gel method. the properties of the films such as film thickness, etching rate in hydrofluoric acid, Vicker's hardness, and the effect of the thermal treatment on the molecular structure were investigated. As a result, it was found that the etching resistance and hardness were improved as the treatment temperature increased. These changes in the properties were related to the density and water content in the film. The molecular structure analysis by the 29Si solid‐state NMR and Raman spectroscopy revealed that the unstable distorted Si‐O‐Si bonds formed in the solution were broken and stable straight Si‐O‐Si bonds were formed during the high‐temperature treatment. As the number of the stable Si‐O‐Si bonds increases, the hardness and density of the films increases.
|ジャーナル||Electronics and Communications in Japan (Part II: Electronics)|
|出版ステータス||Published - 1994 5月|
ASJC Scopus subject areas
- コンピュータ ネットワークおよび通信