The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders

Masayoshi Shimoda, Noboru Hidaka, Mitsuo Yamashita, Kenichi Sakaue, Takeshi Ogawa

研究成果: Conference contribution

5 被引用数 (Scopus)

抄録

Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.

本文言語English
ホスト出版物のタイトルEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
ページ725-730
ページ数6
DOI
出版ステータスPublished - 2009 12 1
外部発表はい
イベント2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
継続期間: 2009 12 92009 12 11

出版物シリーズ

名前Proceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2009 11th Electronic Packaging Technology Conference, EPTC 2009
国/地域Singapore
CitySingapore
Period09/12/909/12/11

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学

フィンガープリント

「The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル