TY - GEN
T1 - The effect of Ni,Ge elements on microstructure and mechanical properties of Sn-Ag-Cu solders
AU - Shimoda, Masayoshi
AU - Hidaka, Noboru
AU - Yamashita, Mitsuo
AU - Sakaue, Kenichi
AU - Ogawa, Takeshi
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.
AB - Sn-Ag-Cu solder alloys have been widely used as lead-free solders following the enactment of the 2007 RoHS Directive. Recently, the content of Ag has been demanded to decrease in the solders for wave soldering process as the cost of Ag has already become very expensive. On the other hand, it was considered that the mechanical strength of the solder tends to be not enough as the amount of Ag decreases. Therefore, the low-Ag solders must be carefully developed to keep the mechanical properties. In this paper, we study the effect of adding small amount of (Ni,Ge) elements on microstructure and mechanical properties of the low-Ag lead-free solders of which the amount of Ag is 0.3wt% and 1.0wt% Indentation testing method was used to obtain mechanical properties including elastic, plastic and creep deformations in this study.
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U2 - 10.1109/EPTC.2009.5416454
DO - 10.1109/EPTC.2009.5416454
M3 - Conference contribution
AN - SCOPUS:77950962747
SN - 9781424451005
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 725
EP - 730
BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
T2 - 2009 11th Electronic Packaging Technology Conference, EPTC 2009
Y2 - 9 December 2009 through 11 December 2009
ER -