The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

E.Hosomi E.Hosomi; C.Takubo C.Takubo; Y.Hiruta Y.Hiruta; T.Sudo T.Sudo; F.Takahashi F.Takahashi; K.Saito K.Saito; N.Nakajima N.Nakajima; M.Nakazono M.Nakazono; Toshio Sudo

The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

E.Hosomi E.Hosomi, C.Takubo C.Takubo, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, F.Takahashi F.Takahashi, K.Saito K.Saito, N.Nakajima N.Nakajima, M.Nakazono M.Nakazono, Toshio Sudo

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ページ（範囲）	128-133
ジャーナル	8th IMC
出版ステータス	Published - 1994 5月 25

引用スタイル

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title = "The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,",

author = "E.Hosomi E.Hosomi and C.Takubo C.Takubo and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and F.Takahashi F.Takahashi and K.Saito K.Saito and N.Nakajima N.Nakajima and M.Nakazono M.Nakazono and Toshio Sudo",

year = "1994",

month = may,

day = "25",

language = "English",

pages = "128--133",

journal = "8th IMC",

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T1 - The Wettability and Bondability Degradation Mechanisms of Tin-plated Copper Leads of Fine Pitch TCP During Thermal and Humid Aging,

AU - E.Hosomi, E.Hosomi

AU - C.Takubo, C.Takubo

AU - Y.Hiruta, Y.Hiruta

AU - T.Sudo, T.Sudo

AU - F.Takahashi, F.Takahashi

AU - K.Saito, K.Saito

AU - N.Nakajima, N.Nakajima

AU - M.Nakazono, M.Nakazono

AU - Sudo, Toshio

PY - 1994/5/25

Y1 - 1994/5/25

M3 - Article

SP - 128

EP - 133

JO - 8th IMC

JF - 8th IMC

ER -