Thermal Analysis of the Double-Crucible Method in Continuous Silicon Czochralski Processing: I. Experimental Analysis

Naoki Ono, Michio Kida, Yoshiaki Arai, Kensho Sahira

研究成果: Article査読

7 被引用数 (Scopus)

抄録

In the double-crucible method, the temperatures of the silicon melt and of the surface of the quartz crucible were measured and compared to those of the single crucible case. The temperature of the crucible is required for the boundary conditions of the numerical simulations. The temperature gradient was measured across the thickness of the inner quartz crucible. The temperature at the outer surface of this crucible was higher by 20-25°C than in the case of the single crucible. The influence of the fed material silicon on the melt temperature, and the temperature response of the CZ system to the heater power change were also investigated.

本文言語English
ページ(範囲)2101-2105
ページ数5
ジャーナルJournal of the Electrochemical Society
140
7
DOI
出版ステータスPublished - 1993 7月
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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