Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

K. Warashina, Y. Kariya, Y. Hirata, M. Otsuka

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

Quad flat pack (QFP) leads/Sn-3.5Ag-X (X=Bi and Cu) joint was thermally cycled between 243 K and 403 K or 273 K and 373 K, and relationship between thermal fatigue of QFP solder joint and isothermal fatigue properties of bulk solder has been discussed. Both metallographic examination and mechanical pull test were preformed to evaluate thermal fatigue damage of the joint. The addition of bismuth drastically degrades the thermal fatigue resistance of Sn-3.5Ag solder. On the other hand the pull strength of Sn-3.5Ag-Cu solder joints slightly decreased with increasing number of thermal cycles, though it still remains higher in comparison to that for conventional Sn-37Pb or bismuth containing solder joints. The behavior observed here reflects the isothermal fatigue properties of bulk solder because thermal fatigue crack initiates at the surface of the solder fillet and propagates within the fillet in an early stage of fatigue damage.

本文言語English
ホスト出版物のタイトルProceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999
編集者Tadatomo Suga, Hiroyuki Yoshikawa, Yasushi Umeda, Fumihiko Kimura, Ryoichi Yamamoto
出版社Institute of Electrical and Electronics Engineers Inc.
ページ626-631
ページ数6
ISBN(電子版)0769500072, 9780769500072
DOI
出版ステータスPublished - 1999
イベント1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999 - Tokyo, Japan
継続期間: 1999 2 11999 2 3

出版物シリーズ

名前Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999

Other

Other1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999
国/地域Japan
CityTokyo
Period99/2/199/2/3

ASJC Scopus subject areas

  • 産業および生産工学
  • 機械工学

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