Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

K. Warashina, Yoshiharu Kariya, Y. Hirata, M. Otsuka

研究成果: Conference contribution

3 引用 (Scopus)

抜粋

Quad flat pack (QFP) leads/Sn-3.5Ag-X (X=Bi and Cu) joint was thermally cycled between 243 K and 403 K or 273 K and 373 K, and relationship between thermal fatigue of QFP solder joint and isothermal fatigue properties of bulk solder has been discussed. Both metallographic examination and mechanical pull test were preformed to evaluate thermal fatigue damage of the joint. The addition of bismuth drastically degrades the thermal fatigue resistance of Sn-3.5Ag solder. On the other hand the pull strength of Sn-3.5Ag-Cu solder joints slightly decreased with increasing number of thermal cycles, though it still remains higher in comparison to that for conventional Sn-37Pb or bismuth containing solder joints. The behavior observed here reflects the isothermal fatigue properties of bulk solder because thermal fatigue crack initiates at the surface of the solder fillet and propagates within the fillet in an early stage of fatigue damage.

元の言語English
ホスト出版物のタイトルProceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999
出版者Institute of Electrical and Electronics Engineers Inc.
ページ626-631
ページ数6
ISBN(電子版)0769500072, 9780769500072
DOI
出版物ステータスPublished - 1999 1 1
イベント1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999 - Tokyo, Japan
継続期間: 1999 2 11999 2 3

Other

Other1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999
Japan
Tokyo
期間99/2/199/2/3

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

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  • これを引用

    Warashina, K., Kariya, Y., Hirata, Y., & Otsuka, M. (1999). Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints. : Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999 (pp. 626-631). [747688] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECODIM.1999.747688