Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Hironori Oota, Shunichi Kikuchi, Hideki Yamabe, Kazuhiko Nakamura

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.

本文言語English
ホスト出版物のタイトル2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOI
出版ステータスPublished - 2010 8 9
イベント2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV, United States
継続期間: 2010 6 22010 6 5

出版物シリーズ

名前2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Conference

Conference2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
CountryUnited States
CityLas Vegas, NV
Period10/6/210/6/5

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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