Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Hironori Oota, Shunichi Kikuchi, Hideki Yamabe, Kazuhiko Nakamura

研究成果: Conference contribution

1 引用 (Scopus)

抄録

The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.

元の言語English
ホスト出版物のタイトル2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOI
出版物ステータスPublished - 2010
イベント2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV
継続期間: 2010 6 22010 6 5

Other

Other2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Las Vegas, NV
期間10/6/210/6/5

Fingerprint

Thermal fatigue
Fatigue testing
Mechanical testing
Fatigue of materials
Coarsening
Soldering alloys
Microstructure
Hot Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

これを引用

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H., & Nakamura, K. (2010). Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing. : 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 [5501291] https://doi.org/10.1109/ITHERM.2010.5501291

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing. / Kanda, Yoshihiko; Zama, Kunihiro; Kariya, Yoshiharu; Oota, Hironori; Kikuchi, Shunichi; Yamabe, Hideki; Nakamura, Kazuhiko.

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 2010. 5501291.

研究成果: Conference contribution

Kanda, Y, Zama, K, Kariya, Y, Oota, H, Kikuchi, S, Yamabe, H & Nakamura, K 2010, Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing. : 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010., 5501291, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010, Las Vegas, NV, 10/6/2. https://doi.org/10.1109/ITHERM.2010.5501291
Kanda Y, Zama K, Kariya Y, Oota H, Kikuchi S, Yamabe H その他. Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing. : 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 2010. 5501291 https://doi.org/10.1109/ITHERM.2010.5501291
Kanda, Yoshihiko ; Zama, Kunihiro ; Kariya, Yoshiharu ; Oota, Hironori ; Kikuchi, Shunichi ; Yamabe, Hideki ; Nakamura, Kazuhiko. / Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing. 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 2010.
@inproceedings{88b6ec45e81d455faeb549652bfd0c44,
title = "Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing",
abstract = "The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.",
keywords = "CSP, Mechanical fatigue test, Microstructure, Sn-Ag-Cu, Thermal cycle test",
author = "Yoshihiko Kanda and Kunihiro Zama and Yoshiharu Kariya and Hironori Oota and Shunichi Kikuchi and Hideki Yamabe and Kazuhiko Nakamura",
year = "2010",
doi = "10.1109/ITHERM.2010.5501291",
language = "English",
isbn = "9781424453429",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",

}

TY - GEN

T1 - Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

AU - Kanda, Yoshihiko

AU - Zama, Kunihiro

AU - Kariya, Yoshiharu

AU - Oota, Hironori

AU - Kikuchi, Shunichi

AU - Yamabe, Hideki

AU - Nakamura, Kazuhiko

PY - 2010

Y1 - 2010

N2 - The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.

AB - The interrelation between a thermal cycle test and a mechanical shear fatigue test has been studied for CSP joints from the view point of fatigue life and the microstructural damage of solder joints. The fatigue lives in both methods are almost equivalent even though loading method is different. From the viewpoint of microstructure, the fact is attributed to that the transgranular failure is predominant mode and a microstructural coarsening which is induced by thermal loading and stress equivalent for both the thermal cycle test and the mechanical shear fatigue test.

KW - CSP

KW - Mechanical fatigue test

KW - Microstructure

KW - Sn-Ag-Cu

KW - Thermal cycle test

UR - http://www.scopus.com/inward/record.url?scp=77955214701&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955214701&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2010.5501291

DO - 10.1109/ITHERM.2010.5501291

M3 - Conference contribution

AN - SCOPUS:77955214701

SN - 9781424453429

BT - 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

ER -