Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint

研究成果: Article › 査読

本文言語	English
ジャーナル	Proc. Of International Conference on Electronics Materials and Packaging
巻	EMAP2011
出版ステータス	Published - 2011 12月 1

引用スタイル

@article{466e236b083c4242853105b0aa421742,

title = "Thermal Fatigue Life Prediction Model and Acceleration Factor for Sn-Ag-Cu Solder Joint",

author = "Y. K and a a and Y. Kariya",

year = "2011",

month = dec,

day = "1",

language = "English",

volume = "EMAP2011",

journal = "Proc. Of International Conference on Electronics Materials and Packaging",

}