Three-dimensional micro modification and selective etching of crystalline silicon using 1.56-μm subpicosecond laser pulses

Engineering & Materials Science

• Laser pulses 100%
• Etching 82%
• Crystalline materials 80%
• Silicon 60%
• Hydrofluoric acid 58%
• Nitric acid 53%
• Lasers 29%
• Substrates 27%

Physics & Astronomy

• etching 58%
• nitric acid 51%
• etchants 47%
• hydrofluoric acid 47%
• silicon 41%
• pulses 38%
• lasers 33%

Chemical Compounds

• Etching 69%
• Modification 43%
• Acid 26%
• Surface 24%