Three-dimensional MMIC and its application: an ultra-wideband miniature balun

Ichihiko Toyoda, Makoto Hirano, Tsuneo Tokumitsu

    研究成果: Article査読

    15 被引用数 (Scopus)

    抄録

    A new three-dimensional MMIC structure and an ultra-wideband miniature MMIC balun are proposed. The MMIC is a combined structure of multilayer MMICs and U-shaped micro-wires. This technology effectively reduces chip size and enhances MMIC performance. The proposed balun is constructed with three narrow conductors located side by side. The U-shaped micro-wire technology is employed to reduce the insertion loss and chip size. 1.5±1 dB insertion loss over 10 to 30 GHz, and 2 dB and 5 degrees of amplitude and phase balances over 5 to 35 GHz have been obtained. The intrinsic area of the balun is only 450 × 800 μm, about 1/5 to 1/3 the area of recently reported miniaturized MMIC baluns.

    本文言語English
    ページ(範囲)919-924
    ページ数6
    ジャーナルIEICE Transactions on Electronics
    E78-C
    8
    出版ステータスPublished - 1995 8 1

    ASJC Scopus subject areas

    • 電子材料、光学材料、および磁性材料
    • 電子工学および電気工学

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