Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors

Koh Inoue, Kenji Kamogawa, Kenjiro Nishikawa, Kenji Ikuta, Kiyomitsu Onodera, Makoto Hirano

    研究成果: Paper査読

    6 被引用数 (Scopus)

    抄録

    This paper presents a new three-dimensional (3-D) MMIC interconnect process using photosensitive BCB (Benzocyclobutene) interlevel dielectric and STO (SrTiO3) capacitors. This technology significantly reduces process turn-around-time (TAT) and chip size. It yields MMICs with wide frequency range because the low temperature process can be applied to InGaAs and InP devices as well as GaAs and Si devices. A 50 GHz-band amplifier is fabricated to demonstrate this technology.

    本文言語English
    ページ642-647
    ページ数6
    DOI
    出版ステータスPublished - 1998 1 1
    イベント1998 28th European Microwave Conference, EuMC 1998 - Amsterdam, Netherlands
    継続期間: 1998 10 51998 10 9

    Conference

    Conference1998 28th European Microwave Conference, EuMC 1998
    国/地域Netherlands
    CityAmsterdam
    Period98/10/598/10/9

    ASJC Scopus subject areas

    • コンピュータ ネットワークおよび通信
    • ハードウェアとアーキテクチャ
    • 電子工学および電気工学

    フィンガープリント

    「Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

    引用スタイル