Three-Dimensional Passive Circuit Technology For Ultra-Compact MMIC' s

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

    研究成果: Article査読

    53 被引用数 (Scopus)

    抄録

    A novel passive circuit technology of a three-dimensional (3-D) metal-insulator structure is developed for ultra-compact MMIC' s. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling, and a pillar-like via connection with multilayer passive circuits, a 3-D passive circuit structure is formed to implement highly dense and more functional MMIC' s. O2/He RIE for forming trenches and holes in a thick plyimide insulator, low-current electroplating for foming gold metal sidewalls in the trenches or holes, and ion-milling with a WSiN stopper layer for patterning the gold metal are used to produce such a structure. The complete 3-D structure provides miniature microstrip lines effectively shielded with a vertical metal-wall, a miniature balun with low-loss vertical wall-like microwires, and inverted microstrip lines jointed with pillar-like vias through a thick polyimide layer. This technology stages next-generation ultra-compact MMIC's by producing various functional passive circuits in a very small area.

    本文言語English
    ページ(範囲)2845-2850
    ページ数6
    ジャーナルIEEE Transactions on Microwave Theory and Techniques
    43
    12
    DOI
    出版ステータスPublished - 1995 12

    ASJC Scopus subject areas

    • 放射線
    • 凝縮系物理学
    • 電子工学および電気工学

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