A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.
|ジャーナル||IEEE MTT-S International Microwave Symposium Digest|
|出版ステータス||Published - 1995 1 1|
|イベント||Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA|
継続期間: 1995 5 16 → 1995 5 20
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering