Three-dimensional passive circuit technology for ultra-compact MMICs

Makoto Hirano, Kenjiro Nishikawa, Ichihiko Toyoda, Shinji Aoyama, Suehiro Sugitani, Kimiyoshi Yamasaki

    研究成果: Conference article査読

    13 被引用数 (Scopus)

    抄録

    A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.

    本文言語English
    ページ(範囲)1447-1450
    ページ数4
    ジャーナルIEEE MTT-S International Microwave Symposium Digest
    3
    出版ステータスPublished - 1995 1 1
    イベントProceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA
    継続期間: 1995 5 161995 5 20

    ASJC Scopus subject areas

    • Radiation
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

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