Three-dimensional passive elements for compact GaAs MMICs

Makoto Hirano, Yuhki Imai, Ichihiko Toyoda, Kenjiro Nishikawa, Masami Tokumitsu, Kazuyoshi Asai

    研究成果: Article査読

    2 被引用数 (Scopus)

    抄録

    Novel three-dimensional structures for passive elements - inductors, capacitors, transmission lines, and air-bridges - have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.

    本文言語English
    ページ(範囲)961-967
    ページ数7
    ジャーナルIEICE Transactions on Electronics
    E76-C
    6
    出版ステータスPublished - 1993 6 1

    ASJC Scopus subject areas

    • 電子材料、光学材料、および磁性材料
    • 電子工学および電気工学

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