Tin pest in lead-free solders

Yoshiharu Kariya, Colin Gagg, William J. Plumbridge

研究成果: Article査読

46 被引用数 (Scopus)

抄録

The low temperature effect on the characteristics of lead-free alloys based on tin (Sn) were analyzed. The allotropic transformation of white tin into grey tin at temperatures below 286 K were studied. The effects of prolonged exposure of Sn-0.5 copper alloy and Sn-37 lead alloy to low temperatures were also studied. The results showed that tin pest at low temperatures lead to the disintegration of real joints.

本文言語English
ページ(範囲)39-40
ページ数2
ジャーナルSoldering and Surface Mount Technology
13
1
DOI
出版ステータスPublished - 2001 1月 1
外部発表はい

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 電子工学および電気工学

フィンガープリント

「Tin pest in lead-free solders」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル