Tin pest in lead-free solders

Yoshiharu Kariya, Colin Gagg, William J. Plumbridge

研究成果: Article

42 被引用数 (Scopus)

抄録

The low temperature effect on the characteristics of lead-free alloys based on tin (Sn) were analyzed. The allotropic transformation of white tin into grey tin at temperatures below 286 K were studied. The effects of prolonged exposure of Sn-0.5 copper alloy and Sn-37 lead alloy to low temperatures were also studied. The results showed that tin pest at low temperatures lead to the disintegration of real joints.

元の言語English
ページ(範囲)39-40
ページ数2
ジャーナルSoldering and Surface Mount Technology
13
発行部数1
DOI
出版物ステータスPublished - 2001 1 1
外部発表Yes

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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