Trends of conductive adhesives in electronics

Katsuaki Suganuma, Daisuke Shindo, Kanji Ohtsuka, Yoshiharu Kariya

研究成果: Article › 査読

本文言語	English
ページ（範囲）	79-85
ページ数	7
ジャーナル	Journal of Japan Institute of Electronics Packaging
巻	12
号	1
DOI	https://doi.org/10.5104/jiep.12.79
出版ステータス	Published - 2009 1月

ASJC Scopus subject areas

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