抜粋
In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.
| 元の言語 | English |
|---|---|
| ページ | 599-602 |
| ページ数 | 4 |
| 出版物ステータス | Published - 2005 1 1 |
| イベント | 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 - Montpellier, France 継続期間: 2005 5 8 → 2005 5 11 |
Conference
| Conference | 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 |
|---|---|
| 国 | France |
| 市 | Montpellier |
| 期間 | 05/5/8 → 05/5/11 |
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Mechanical Engineering
- Materials Science(all)
- Environmental Engineering
- Instrumentation
フィンガープリント Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。
これを引用
Yasui, H., Yamamoto, Y., & Sawa, T. (2005). Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. 599-602. 論文発表場所 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005, Montpellier, France.