抄録
In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.
| 元の言語 | English |
|---|---|
| ホスト出版物のタイトル | EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology |
| 出版者 | euspen |
| ページ | 599-602 |
| ページ数 | 4 |
| 出版物ステータス | Published - 2005 |
| 外部発表 | Yes |
| イベント | 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 - Montpellier 継続期間: 2005 5 8 → 2005 5 11 |
Other
| Other | 5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 |
|---|---|
| 市 | Montpellier |
| 期間 | 05/5/8 → 05/5/11 |
Fingerprint
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Mechanical Engineering
- Materials Science(all)
- Environmental Engineering
- Instrumentation
これを引用
Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm. / Yasui, Heiji; Yamamoto, Yuki; Sawa, Takekazu.
EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology. euspen, 2005. p. 599-602.研究成果: Conference contribution
}
TY - GEN
T1 - Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm
AU - Yasui, Heiji
AU - Yamamoto, Yuki
AU - Sawa, Takekazu
PY - 2005
Y1 - 2005
N2 - In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.
AB - In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.
UR - http://www.scopus.com/inward/record.url?scp=84884766487&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84884766487&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84884766487
SP - 599
EP - 602
BT - EUSPEN 2005 - Proceedings of the 5th International Conference of the European Society for Precision Engineering and Nanotechnology
PB - euspen
ER -