Ultra-smoothness grinding of silicon carbide in depth of cut of 1mm

Heiji Yasui, Yuki Yamamoto, Takekazu Sawa

研究成果: Paper査読

2 被引用数 (Scopus)

抄録

In our previous researches, the newly devised ultra-smoothness grinding method is proposed and ascertained to be useful for finishing fine ceramics to the ultra-smoothness surface below 30 nm(Rz) or 5 nm(Ra). In the research, the influence of depth of cut on ultra-smoothness grinding of a silicon carbide ceramic is examined. The depth of cut ranges from 5 micro-meters to 1 mm. In the ultra-smoothness grinding method, it is found possible to finish the silicon carbide ceramic to high smoothness surface at even the depth of cut of 1 mm using metal bonded diamond wheel of coarse grain size of #140.

本文言語English
ページ599-602
ページ数4
出版ステータスPublished - 2005 1 1
外部発表はい
イベント5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005 - Montpellier, France
継続期間: 2005 5 82005 5 11

Conference

Conference5th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2005
国/地域France
CityMontpellier
Period05/5/805/5/11

ASJC Scopus subject areas

  • 産業および生産工学
  • 機械工学
  • 材料科学(全般)
  • 環境工学
  • 器械工学

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