Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer

Kazuyoshi Ueno, A. Sekiguchi, A. Kobayashi

研究成果: Conference contribution

1 引用 (Scopus)

抄録

The vacuum anneal effects of the Cu seed on Cu CVD have been investigated. The vacuum anneal removes the surface oxide of the air-exposed Cu seed and enhances the (111) texture of the seed. The incubation period which has been observed with the air-exposed Cu seed has been eliminated by the vacuum anneal and better film morphology and improved sheet resistance uniformity has been obtained. Epitaxial CVD has been observed on the vacuum annealed seed and led to the enhanced (111) texture.

元の言語English
ホスト出版物のタイトルProceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998
出版者Institute of Electrical and Electronics Engineers Inc.
ページ119-121
ページ数3
1998-June
ISBN(電子版)0780342852, 9780780342859
DOI
出版物ステータスPublished - 1998 1 1
外部発表Yes
イベント1998 IEEE International Interconnect Technology Conference, IITC 1998 - San Firancisco, United States
継続期間: 1998 6 11998 6 3

Other

Other1998 IEEE International Interconnect Technology Conference, IITC 1998
United States
San Firancisco
期間98/6/198/6/3

Fingerprint

Seed
Chemical vapor deposition
Vacuum
Textures
Sheet resistance
Air
Oxides

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Ueno, K., Sekiguchi, A., & Kobayashi, A. (1998). Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. : Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998 (巻 1998-June, pp. 119-121). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.1998.704768

Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. / Ueno, Kazuyoshi; Sekiguchi, A.; Kobayashi, A.

Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. 巻 1998-June Institute of Electrical and Electronics Engineers Inc., 1998. p. 119-121.

研究成果: Conference contribution

Ueno, K, Sekiguchi, A & Kobayashi, A 1998, Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. : Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. 巻. 1998-June, Institute of Electrical and Electronics Engineers Inc., pp. 119-121, 1998 IEEE International Interconnect Technology Conference, IITC 1998, San Firancisco, United States, 98/6/1. https://doi.org/10.1109/IITC.1998.704768
Ueno K, Sekiguchi A, Kobayashi A. Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. : Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. 巻 1998-June. Institute of Electrical and Electronics Engineers Inc. 1998. p. 119-121 https://doi.org/10.1109/IITC.1998.704768
Ueno, Kazuyoshi ; Sekiguchi, A. ; Kobayashi, A. / Uniform (111) textured Cu CVD on vacuum annealed Cu seed layer. Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998. 巻 1998-June Institute of Electrical and Electronics Engineers Inc., 1998. pp. 119-121
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