Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata

研究成果: Conference contribution

1 引用 (Scopus)

抄録

The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

元の言語English
ホスト出版物のタイトルProceedings of the ASME InterPack Conference 2009, IPACK2009
ページ755-759
ページ数5
1
DOI
出版物ステータスPublished - 2010
イベント2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA
継続期間: 2009 7 192009 7 23

Other

Other2009 ASME InterPack Conference, IPACK2009
San Francisco, CA
期間09/7/1909/7/23

Fingerprint

Reliability analysis
Fatigue of materials
Finite element method
Viscoelasticity
Thermal cycling
Soldering alloys
Cooling
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., ... Hirata, K. (2010). Visco-elastic effect of underfill material in reliability analysis of flip-chip package. : Proceedings of the ASME InterPack Conference 2009, IPACK2009 (巻 1, pp. 755-759) https://doi.org/10.1115/InterPACK2009-89152

Visco-elastic effect of underfill material in reliability analysis of flip-chip package. / Kanda, Yoshihiko; Zama, Kunihiro; Kariya, Yoshiharu; Mikami, Takao; Kobayashi, Takaya; Sato, Toshiyuki; Enomoto, Toshiaki; Hirata, Koichi.

Proceedings of the ASME InterPack Conference 2009, IPACK2009. 巻 1 2010. p. 755-759.

研究成果: Conference contribution

Kanda, Y, Zama, K, Kariya, Y, Mikami, T, Kobayashi, T, Sato, T, Enomoto, T & Hirata, K 2010, Visco-elastic effect of underfill material in reliability analysis of flip-chip package. : Proceedings of the ASME InterPack Conference 2009, IPACK2009. 巻. 1, pp. 755-759, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, 09/7/19. https://doi.org/10.1115/InterPACK2009-89152
Kanda Y, Zama K, Kariya Y, Mikami T, Kobayashi T, Sato T その他. Visco-elastic effect of underfill material in reliability analysis of flip-chip package. : Proceedings of the ASME InterPack Conference 2009, IPACK2009. 巻 1. 2010. p. 755-759 https://doi.org/10.1115/InterPACK2009-89152
Kanda, Yoshihiko ; Zama, Kunihiro ; Kariya, Yoshiharu ; Mikami, Takao ; Kobayashi, Takaya ; Sato, Toshiyuki ; Enomoto, Toshiaki ; Hirata, Koichi. / Visco-elastic effect of underfill material in reliability analysis of flip-chip package. Proceedings of the ASME InterPack Conference 2009, IPACK2009. 巻 1 2010. pp. 755-759
@inproceedings{20763307603046c2a360bd64237f62e6,
title = "Visco-elastic effect of underfill material in reliability analysis of flip-chip package",
abstract = "The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.",
author = "Yoshihiko Kanda and Kunihiro Zama and Yoshiharu Kariya and Takao Mikami and Takaya Kobayashi and Toshiyuki Sato and Toshiaki Enomoto and Koichi Hirata",
year = "2010",
doi = "10.1115/InterPACK2009-89152",
language = "English",
isbn = "9780791843598",
volume = "1",
pages = "755--759",
booktitle = "Proceedings of the ASME InterPack Conference 2009, IPACK2009",

}

TY - GEN

T1 - Visco-elastic effect of underfill material in reliability analysis of flip-chip package

AU - Kanda, Yoshihiko

AU - Zama, Kunihiro

AU - Kariya, Yoshiharu

AU - Mikami, Takao

AU - Kobayashi, Takaya

AU - Sato, Toshiyuki

AU - Enomoto, Toshiaki

AU - Hirata, Koichi

PY - 2010

Y1 - 2010

N2 - The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

AB - The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

UR - http://www.scopus.com/inward/record.url?scp=77953742803&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77953742803&partnerID=8YFLogxK

U2 - 10.1115/InterPACK2009-89152

DO - 10.1115/InterPACK2009-89152

M3 - Conference contribution

AN - SCOPUS:77953742803

SN - 9780791843598

VL - 1

SP - 755

EP - 759

BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009

ER -