Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

The effect of viscoelasticity of underfill on the reliability analysis of flip-chip package by using FEA has been investigated in this study. The analytical result on thermal warpage of a package is different depending on whether the underfill is assumed to be elastic or viscoelastic. The difference is prominent in materials with low Tg, specifically during the cooling process. The viscoelastic effect of the underfill on the fatigue life of the solder bumps is also appears in materials with low Tg, and the predicted fatigue life of a package is about twice as short if the underfill is assumed to be elastic instead of viscoelastic. Thus, the differences in the assumption regarding the viscoelastic properties of the underfill affect the reliability analysis of the packages under thermal cycling condition using FEA.

本文言語English
ホスト出版物のタイトルProceedings of the ASME InterPack Conference 2009, IPACK2009
ページ755-759
ページ数5
DOI
出版ステータスPublished - 2010 6 25
イベント2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
継続期間: 2009 7 192009 7 23

出版物シリーズ

名前Proceedings of the ASME InterPack Conference 2009, IPACK2009
1

Conference

Conference2009 ASME InterPack Conference, IPACK2009
国/地域United States
CitySan Francisco, CA
Period09/7/1909/7/23

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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